Heat Transfer Modeling Downflowing Laminar Films with the Developed Wavy Structure with co-Current Steam Flow

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Дата

2016

ORCID

DOI

Науковий ступінь

Рівень дисертації

Шифр та назва спеціальності

Рада захисту

Установа захисту

Науковий керівник

Члени комітету

Видавець

Анотація

The result of heat transfer modeling in down flowing viscous laminar films with the developed wavy structure at the regime of evaporation from film interface at free falling and with co-current steam flow, a heat transfer model, which takes into account a cyclic process of temperature field relaxation with the periodic mixing of film by big waves, has been presented. A mathematical model of heat transfer in laminar, heated to the saturation temperatures liquid films with the developed wavy structures on the free interface have been developed. The model takes into consideration cyclic relaxation of transient temperature field which happens right after the passage of a powerful big wave. The developed mathematical model describes the time history of the two dimensional temperature fields as a function of the Peclet number and the core characteristic of the wavy motion (the length of big waves). Based upon the proposed model a set of correlations have been obtained. These are proposed as a means for the generalization of heat transfer experimental data, obtained within the experimental studies of liquid films, heated to the saturation temperatures and evaporating from the interface. A generalized equation has been derived, which can be used for the calculations of Heat Transfer Coefficients (HTC) to the saturated sugar solutions liquid films.

Опис

Ключові слова

плівка, хвилі, теплообмін, температура, випаровування, films, waves, heat transfer, temperature, evaporation, кафедра теплоенергетики та холодильної техніки

Бібліографічний опис

Heat Transfer Modeling Downflowing Laminar Films with the Developed Wavy Structure with co-Current Steam Flow / V. Petrenko, Y. Zasyadko // Food and Environment Safety. – 2016. – Volume 15, Issue 3. – P. 203–215.

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